1600 Boston-Providence Hwy Walpole, MA 02081
+1 866-956-5888
+1 866-956-5819

CSI Chicago Chapter Meeting – The Evolving Landscape of Commercial Energy Efficiency

Loading Events

« All Events

  • This event has passed.

CSI Chicago Chapter Meeting – The Evolving Landscape of Commercial Energy Efficiency

October 8 @ 5:30 PM - 9:00 PM PDT

When: Tuesday, October 8, 2024 from 4:30 PM to 8:00 PM (CT)

Where: Maggiano’s Little Italy Grand – 516 N Clark St. Chicago, IL 60654

Event Agenda

4:30 pm: Networking – visit tabletop sponsors (5) and socialize with members

5:45 pm: Welcome, Chapter Announcements & Dinner

6:30 pm (approx.): Educational Presentation – The Evolving Landscape of Commercial Energy Efficiency – Understanding and Applying New Codes, presented by Keith A. Simon, FAIA, CPHC, BECxP, CxA+BE, LEED AP, CEI, Vice President, Design Phase Services, Salas O’Brien

Register Here

Keith Simon is a Registered Architect, Certified Passive House Consultant (CPHC), Legacy LEED AP, and Building Enclosure Commissioning Provider (BECxP) with over 15 years’ experience in architectural design and building enclosure consultation. His experience includes peer review, design assistance, durability analysis, construction administration, testing, and forensics of building envelope issues. Mr. Simon was the founder of the Austin Building Enclosure Council (BEC: Austin) and currently serves as a board member for both BEC: Austin as well as the Passive House Austin Chapter and serves as Secretary on the Executive Committee for the National Institute of Building Sciences (NIBS) Building Enclosure Technology and Environment Council (BETEC). Mr. Simon is a Terracon SME (Subject Matter Expert) for Hygrothermal Modeling and Building Enclosure Commissioning. Mr. Simon is also a member of the American Institute of Architects (AIA), the Society of Building Science Educators (SBSE), and is adjunct faculty at the University of Texas School of Architecture (UTSoA) in Austin. Mr. Simon was awarded the 2017 Terracon Company-Wide Outstanding Technical Contributor Award.